Work table for laser processing and method of operating the same

ABSTRACT

A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority under 35 USC § 119 to Korean PatentApplication No. 10-2016-0164489, filed on Dec. 5, 2016 in the KoreanIntellectual Property Office (KIPO), the contents of which areincorporated by reference herein in its entirety.

TECHNICAL FIELD

The present disclosure relates to a work table, and more particularly,to a work table for laser processing and a method of operating the worktable.

DISCUSSION OF THE RELATED ART

In laser processing, a laser beam is used to cut a substrate, or to forma particular pattern on the substrate. Such laser processing isgenerally performed by arranging the substrate on a work table andirradiating the substrate with the laser beam. As the substrate isprocessed, the substrate and the work table may become contaminated byfine particles and fumes that are biproducts of the laser processing.

SUMMARY

A work table for laser processing includes an upper plate including aplurality of cell regions and at least one groove region that dividesthe plurality of cell regions. The upper plate includes a plurality ofabsorption holes that fix a substrate in the plurality of cell regions.A plurality of suction holes collect particles generated during acutting process performed on the substrate. A lower plate is disposedunder the upper plate. The lower plate forms an absorption path that iscoupled to the plurality of absorption holes. A suction path is coupledto the plurality of suction holes by combining the lower plate with theupper plate.

A method of operating a work table for laser processing includesdisposing a work table for laser processing on a base. A substrate isfixed to the work table using one or more absorption holes of the worktable. The fixed substrate is cut using a laser beam. Particlesgenerated during the cutting of the substrate are collected using one ormore suction holes of the work table.

A work table includes an upper plate including a plurality of grooveregions disposed in rows and columns and defining a plurality of cellregions at intersections of the plurality of groove regions. A pluralityof absorption holes is disposed on the upper plate. The plurality ofabsorption holes is configured to fix a substrate to the upper platewith vacuum pressure while the substrate is cut using a laser. Aplurality of suction holes is disposed on the upper plate. The pluralityof suction holes is configured to collect particles generated during thecutting of the substrate. A lower plate is disposed under the upperplate. The lower plate is configured to define an absorption pathbetween the lower plate and the upper plate, and to define a suctionpath between the lower plate and the upper plate. The absorption path iscoupled to the plurality of absorption holes. The suction path coupledto the plurality of suction holes.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present disclosure and many of theattendant aspects thereof will be readily obtained as the same becomesbetter understood by reference to the following detailed descriptionwhen considered in connection with the accompanying drawings, wherein:

FIG. 1 is a perspective view illustrating a work table for laserprocessing according to exemplary embodiments of the present invention;

FIG. 2 is a plane view illustrating region A of FIG. 1 according toexemplary embodiments of the present invention;

FIG. 3A is a cross-sectional view illustrating a work table taken alongsection line I-I′ of FIG. 2 according to exemplary embodiments of thepresent invention;

FIG. 3B is a cross-sectional view illustrating a work table taken alongsection line I-I′ of FIG. 2 according to exemplary embodiments of thepresent invention;

FIG. 4A is a cross-sectional view illustrating a work table taken alongsection line II-II′ of FIG. 2 according to exemplary embodiments of thepresent invention;

FIG. 4B is a cross-sectional view illustrating a work table taken alongsection line II-II′ of FIG. 2 according to exemplary embodiments of thepresent invention;

FIG. 5 is a diagram illustrating the work table for laser processing ofFIG. 1 according to exemplary embodiments of the present invention;

FIG. 6 is a flow chart illustrating a method of operating a work tablefor laser processing according to exemplary embodiments of the presentinvention; and

FIG. 7 is a flow chart illustrating a method for performing a cleaningoperation for the work table for laser processing of FIG. 6 according toexemplary embodiments of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, the present inventive concept will be explained in detailwith reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a work table for laserprocessing according to exemplary embodiments of the present invention.

Referring to FIG. 1, a work table 100 for laser processing may includean upper plate 110 and a lower plate 120. The work table 100 may be usedto perform laser processing. The work table 100 may be disposed on abase device. The work table 100 may be designed to accommodate a size ofa substrate and a shape of the substrate. The substrate may be loaded onthe work table 100. The work table 100 may fix the substrate theretousing one or more absorption holes through which vacuum pressure isapplied. Further, the work table 100 may discharge particles and fumesgenerated during a laser cutting process using the absorption hole.

The upper plate 110 may include a plurality of cell regions CA andgroove regions GA that divide the cell regions CA. At least oneabsorption hole that fixes the substrate may be formed in the cellregion CA. At least one suction hole that sucks particles generated inthe laser cutting process may be formed in the groove region GA.

The upper plate 110 may include a first surface that loads the substrateand a second surface that is combined with the lower plate 120. Theplurality of cell regions CA and the groove regions GA that divide thecell regions CA may be formed on the first surface of the upper plate110. The laser beam may cut the substrate along the groove regions GA.The absorption holes may be formed in the cell region CA of the upperplate 110. The absorption holes may be coupled to absorption pathsformed by combining the upper plate 110 and the lower plate 120. Theabsorption paths may be coupled to an external absorption device througha first channel 130. Although the first channel 130 coupled to the upperplate 110 is depicted, the first channel 130 may be formed in the lowerplate 120 or may be formed between the upper plate 110 and the lowerplate 120. An absorptive force (e.g. a vacuum pressure) may betransferred to the absorption holes according to an operation of theexternal absorption device. For example, the absorption device may be avacuum motor/pump. The absorptive force may be transferred to the cellregion CA of the upper plate 110 through the absorption holes and thesubstrate may be accordingly fixed on the upper plate 110. The suctionholes may be formed in the groove region GA of the upper plate 110. Thesuction holes may be coupled to a suction path. The suction path may becoupled to an external exhaust device through a second channel 140. Asuction force may be transferred to the suction holes according to anoperation of the external exhaust device. For example, the externalexhaust device may include an inhalation motor and a dust collector. Thesuction force may be transferred to the groove regions GA of the upperplate 110 through the suction holes. Particles and fumes generated in acutting process using the laser beam may be collected through thesuction holes. A low-contamination surface treatment is performed on thegroove regions GA, the suction holes, and the suction path. In someexemplary embodiments of the present invention, a surface of the grooveregions GA, a surface of the suction holes, and a surface of the suctionpath may be coated with Teflon or Polyether ether ketone (Peek). Whenthe low-contamination surface treatment is performed on the grooveregions GA, the suction holes, and the suction path, residues of theparticles or residues of the fumes might not remain on the grooveregions GA, the suction holes, and the suction path. In some exemplaryembodiments, a plurality of bumps may be formed on the surface of thegroove regions GA, the surface of the suction holes, and the surface ofthe suction path. When the bumps are formed on the surface of the grooveregions GA, the surface of the suction holes, and the surface of thesuction path, the particles and fumes inhaled through the suction holesand the suction path may be collected on the bumps. A size of eachsuction hole may be the same or may be bigger than a size the absorptionhole. The size of each suction hole may be at least large enough to passthe particles and the fumes therethrough.

The lower plate 120 may be disposed under the upper plate 110. The lowerplate 120 may form the absorption path coupled to the absorption holesand the suction path coupled to the suction holes by combining with theupper plate 110.

The lower plate 120 may include a first surface combined with the upperplate 110 and a second surface loaded on the base device. The firstsurface of the lower plate 120 may form the absorption path and thesuction path by combining with the second surface of the upper plate110. In some exemplary embodiments of the present invention, theabsorption path may be formed by combining a concave part formed on thesecond surface of the upper plate 110 and a concave part formed on thefirst surface of the lower plate 120. In some exemplary embodiments ofthe present invention, the absorption path may be formed by combining aconcave part formed on the second surface of the upper plate 110 and aflat part of the first surface of the lower plate 120. The absorptionpath may be coupled to the external absorption device through the firstchannel 130 formed in a side of the upper place 110 or the lower place.The absorption path may transfer the absorptive force to the absorptionholes, according to the external absorption device. A manifold may beformed between the absorption path and the external absorption device inorder to lead inhalation to the absorption holes. The suction path maybe formed in the lower plate 120. For example, the suction path may beformed on the lower plate 120 using gun drill processing. The suctionpath may couple the suction holes formed in the groove regions GA. Thesuction path may be coupled to the external exhaust device. The suctionpath may transfer the suction force to the suction holes according tothe operation of the external exhaust device. A manifold may be disposedbetween the suction path and the external exhaust device in order tolead exhaust to the suction hole. A pressure of the absorption path anda pressure of the suction path may be different from each other. Forexample, the pressure of the absorption path may be greater (e.g., havemore vacuum force) than the pressure of the suction path in order toincrease the adhesive force of the substrate.

The work table 100 for laser processing may further include a seal block150 (see FIGS. 3A-4B) that seals the suction hole. The seal block 150may block air flow into the suction path. The seal block 150 may beformed between the second surface of the upper plate 110 and the firstsurface of the lower plate 120. For example, the seal block 150 may beimplemented as an O-ring that includes elastic material and may beinserted into a groove part formed in the first surface of the lowerplate 120. A combining member such as a clamp may be formed on thesecond surface of the lower plate 120 in order to combine with the basedevice.

The suction path may be coupled to an external blower in performing acleaning of the work table 100. The blower may provide air or materialhaving positive pressure to the suction holes in an opposite directionto the air provided from the exhaust device coupled to the suction holesduring the cutting process. Thus, the particles and fumes accumulated inthe suction holes may be removed. Here, the external blower may ionizethe particles and the fumes in the suction path. For example, theexternal blower may ionize the particles and the fumes on the surface ofthe suction path by spraying nitrogen (N) to the suction path. Theparticles and the fumes, once ionized, may be more easily detached fromthe surface of the suction path because adhesion of the particles andthe fumes may become weak. Further, the work table 100 for laserprocessing may remove the particles and fumes in the groove regions GAusing an ultrasonic wave cleaning technique.

As described above, the suction holes may be formed in the grooveregions GA of the work table 100. The work table 100 for laserprocessing may reduce contamination of the substrate generated in thecutting process using the laser beam by exhausting the particles andfumes generated in the grove region GA through the suction holes.Further, process efficiency may be increased by performing a prolongedcleaning cycle on the work table 100.

FIG. 2 is a plane view illustrating the region A of FIG. 1. FIG. 3A is across-sectional view illustrating an exemplary embodiment of the presentinvention taken along section line I-I′ of FIG. 2 and FIG. 3B is across-sectional view illustrating an exemplary embodiment of the presentinvention taken along section line I-I′ of FIG. 2.

Referring to FIG. 2, the first surface of the upper plate 110 mayinclude the cell region CA and the groove region GA. The substrate maybe loaded on the first surface of the upper plate 110. The laser beammay be directed to the substrate along the groove region GA.

The plurality of absorption holes 112 may be formed in the cell regionCA. Although the absorption holes 112 having regular spacing aredescribed in FIG. 2, the absorption holes 112 are not limited to havingregular spacing. For example, the absorption holes 112 may haveirregular spacing. The absorption holes 112 may be coupled to theabsorption path 122 as described in FIGS. 3A and 3B. The absorption path122 may be formed by combining the concave part of the upper plate 110coupled to the absorption holes 112 and the concave part of the lowerplate 120 as described in FIG. 3A. The absorption path 122 may be formedby combining the concave part of the upper plate 110 coupled to theabsorption holes 112 and the flat part of the lower plate 120. Theabsorption path 122 may be coupled to the external absorption devicethrough the first channel 130 formed on the side of the upper plate 110or the lower plate 120. The absorption device may transfer theabsorptive force to the absorption holes 112 through the absorption path122.

The plurality of suction holes 114 may be formed in the groove regionsGA. The low-contamination surface treatment may be performed on thegroove region GA. For example, the groove regions GA may be coated withTeflon or Polyether ether ketone (Peek). Although the suction holes 114having regular spacing are described in FIG. 2, the suction holes 114are not limited thereto. For example the suction holes 114 may haveirregular spacing. The suction holes 114 may be coupled to the suctionpath 124 as described in FIGS. 3A and 3B. The suction path 124 may beformed in the lower plate 120 using gun drill processing. The suctionpath 124 may be coupled to the external exhaust device through thesecond channel 140 formed in the side of the lower plate 120. Theexhaust device may transfer suction force to the suction holes throughthe suction path 124. The low-contamination surface treatment may beperformed on the suction holes 114 and the suction path 124. Forexample, the suction holes 114 and the suction path 124 may be coatedwith Teflon or Polyether ether ketone (Peek). The particles and fumesmight not remain on the suction holes 114 and the suction path 124 whenthe low-contamination surface treatment is performed on the suctionholes 114 and the suction path 124. The bumps may be formed on thesurface of the suction holes 114 and the suction path 124. The particlesand fumes may be collected on the bumps 160 when the bumps are formed onthe surface of the suction holes 114 and the suction path 124.

Referring to FIG. 3A, the upper plate 110 may be stacked on the lowerplate 120. The absorption path 122 and the suction path 124 may beformed by combining the upper plate 110 and the lower plate 120. Asdescribed in FIG. 3A, the absorption path 122 may be formed by combiningthe concave part of the upper plate 110 and the concave part of thelower plate 120. The absorption path 122 may be coupled to theabsorption holes 112. The absorption path 122 may be coupled to thefirst channel 130 formed in the side of the upper plate 110 or the lowerplate 120. The absorption path 122 may transfer the absorptive force tothe absorption holes 112. The suction path 124 may be formed in thelower plate 120 using gun drill processing. The suction path 124 may becoupled to the suction holes 112 of the upper plate 110. The suctionpath 124 may be coupled to the second channel 140 formed in the side ofthe lower plate 120. The suction path 124 may transfer the suction forceto the suction holes 114. The seal block 150 that seals the air flowinto the suction path 124 may be formed. The seal block 150 may beformed between the upper plate 110 and the lower plate 120. For example,the seal block may include an elastic O-ring that may be inserted into agroove part formed in the lower plate 120.

Referring to FIG. 3B, the upper plate 110 may be stacked on the lowerplate 120. The absorption path 122 and the suction path 124 may beformed by combining the upper plate 110 and the lower plate 120. Asdescribed in FIG. 3B, the absorption path 122 may be formed by combiningthe concave part of the upper plate 110 and the flat part of the lowerplate 120. The absorption path 122 may be coupled to the absorptionholes 112. The absorption path 122 may be coupled to the first channel130 formed in the side of the upper plate 110 or the lower plate 120.The absorption path 122 may transfer the absorptive force to theabsorption holes 112. The suction path 124 may be formed in the lowerplate 120 using gun drill processing. The suction path 124 may becoupled to the suction holes 112 of the upper plate 110. The suctionpath 124 may be coupled to the second channel 140 formed in the side ofthe lower plate 120. The suction path 124 may transfer the suction forceto the suction holes 114. The seal block 150 that seals the air flowinto the suction path 124 may be formed. The seal block 150 may beformed between the upper plate 110 and the lower plate 120. For example,the seal block may include an elastic O-ring that may be inserted into agroove part formed in the lower plate 120.

FIG. 4A is a cross-sectional view illustrating section line II-II′ ofFIG. 2 and FIG. 4B is a cross-sectional view illustrating section lineII-II′ of FIG. 2, in accordance with exemplary embodiments of thepresent invention.

Referring to FIGS. 4A and 4B, the plurality of suction holes 114 may beformed in the groove region GA of the upper plate 110. The plurality ofsuction holes 114 may be coupled to the suction path 124 formed in thelower plate 120. The suction path 124 may be formed using gun drillprocessing. The suction path 124 may be coupled to the external exhaustdevice. The suction path 124 may transfer the suction force to thesuction holes 114 according to the operation of the external exhaustdevice. For example, the external exhaust device may include aninhalation motor and a dust collector. Further, the suction path 124 maybe coupled to the external blower in the cleaning process of the worktable 100. The blower may provide air or material having positivepressure to the suction holes in an opposite direction to the airprovided from the exhaust device coupled to the suction holes during thecutting process. Thus, the particles and fumes accumulated in thesuction holes may be removed. Here, the external blower may ionize theparticles and the fumes in the suction path. For example, the externalblower may ionize the particles and the fumes on the surface of thesuction path by spraying nitrogen (N) to the suction path. The particlesand the fumes, once ionized, may be more easily detached from thesurface of the suction path because adhesion of the particles and thefumes may be weakened. Further, the work table 100 for laser processingmay remove the particles and fumes in the groove region GA usingultrasonic wave cleaning.

The low-contamination surface treatment may be performed on the grooveregion GA, the suction holes 114, and the suction path 124. As describedin FIG. 4B, the bumps 160 may be formed on the surface of the grooveregion GA, the surface of the suction holes 114, and the surface of thesuction path 124. When the bumps are formed on the surface of the grooveregion GA, the surface of the suction holes 114, and the surface of thesuction path 124, the particles and fumes inhaled through the suctionholes 114 and the suction path 124 may be collected on the bumps 160.Although bumps 160 having trapezoidal shape is illustrated in FIG. 4B,the shape of the bumps 160 is not limited thereto. For example, thebumps 160 may have a triangle shape, a square shape, a hemisphere shape,cylinder shape, etc. Further, although the work table 100 having bumps160 formed on the surface of the groove region GA, the surface of thesuction holes 114, and the surface of the suction path 124 isillustrated in FIG. 4B, the low-contamination surface treatment is notlimited thereto. For example, the surface of the groove region GA, thesurface of the suction holes 114, and the surface of the suction path124 may be coated with Teflon or Polyether ether ketone (Peek). When thesurface of the groove region GA, the surface of the suction holes 114,and the surface of the suction path 124 are coated with Teflon orPolyether ether ketone (Peek), residues of the particles or residues ofthe fumes might not remain on the groove region GA, the suction holes114, or the suction path 124. Further, concave parts may be formed onthe surface of the groove region GA, the surface of the suction holes114, and the surface of the suction path 124. When the groove region GA,the suction holes 114, and the suction path 124 have the concave parts,the particles and fumes may be collected in the concave parts.

FIG. 5 is a diagram illustrating the work table for laser processing ofFIG. 1.

Referring to FIG. 5, the work table 100 for laser processing may becoupled to a first manifold 200 and a second manifold 300. The worktable 100 for laser processing may have the first channel 130 and thesecond channel 140 on the side of the upper plate 110 and the lowerplate 120. The first channel 130 may be coupled to the absorption path122 formed on the work table 100 for laser processing. The first channel130 may be coupled to the first manifold 200. The first manifold 200 maybe coupled to the absorption device 250. The first manifold 200 maycontrol an amount of air flow into the absorption path 122. Theabsorptive force may be transferred to the absorption holes 112according to the operation of the absorption device 250. For example,the absorption device may be a vacuum motor. The absorptive force may betransferred to the cell region CA of the upper plate 110 through theabsorption hole, and then the substrate may be fixed on the upper plate110. The second channel 140 may be coupled to the suction path 124formed on the work table 100 for laser processing. The second channel140 may be coupled to the second manifold 300. The second manifold maybe coupled to the exhaust device 350. The second manifold 300 maycontrol an amount of air flow into the suction path 124. The suctionforce may be transferred to the suction holes 114 according to theoperation of the exhaust device 350. For example, the exhaust device 350may be implemented as the inhalation motor and the dust collector. Thesuction force may be transferred to the groove region GA of the upperplate 110 through the suction holes 114, and then the particles and thefumes generated in the cutting process using the laser beam may beremoved.

The second manifold 300 may be coupled to the blower in the cleaningprocess of the work table 100 for laser processing. The air may betransferred to the suction holes 114 according to the operation of theblower, and then the particles and fumes accumulated on the suction path124 and the suction holes 114 may be removed. For example, the particlesand fumes may be ionized by nitrogen (N) that may be sprayed from theblower. The particles and fumes may be more easily detached from thesuction path 124 and the suction holes 114 because the adhesion force ofthe particles and fumes weaken. Alternatively, the blower may bedirectly coupled to the second channel 140.

FIG. 6 is a flow chart illustrating a method for operating a work tablefor laser processing according to exemplary embodiments of the presentinvention.

A method of operating a work table for laser processing may include astep of disposing the work table for laser processing onto a baseddevice S100. A substrate may be loaded on to the work table for laserprocessing S200. The substrate may be fixed on the work table for laserprocessing using an absorption holes S300. The substrate may be cutusing laser beam S400. Particles generated in the cutting process of thesubstrate may be collected using the suction holes S500.

The work table for laser processing may be disposed on the base deviceS100. The base device may be disposed in a space in which the laserprocessing is performed. The based device may support the work table forlaser processing. The work table placed on the base device may beconfigured according to a size and a shape of the substrate.

The substrate may be loaded on the work table for laser processing S200.The substrate may be disposed on the work table for laser processaccording to align marks on the work table for laser processing.

The substrate may be fixed on the work table for laser processing usingthe absorption holes S300. The work table for laser processing mayinclude cell regions. The plurality of absorption holes may be formed inthe cell regions of the work table for laser processing. The absorptionholes may be coupled to an absorption path formed by combining an upperplate and a lower plate, for example in the manner described above. Theabsorption path may be coupled to an external absorption device througha first channel. The absorptive force may be transferred to theabsorption holes according to an operation of the absorption device. Forexample, the absorption device may be implemented as a vacuum motor. Theabsorptive force may be transferred to the cell region of the upperplate through the absorption hole, and then the substrate may be fixedon the work table for laser processing.

The substrate may be cut using the laser beam S400. The laser beam maybe disposed above the work table for laser processing. For example, thesubstrate may be disposed between the laser beam and the work table forlaser processing. The laser beam may be controlled according to a kindof laser processing being performed and/or by a kind of substrate used.The substrate nay be irradiated by the laser beam according to thegroove region of the work table for laser processing.

The particles venerated in the cutting process of the substrate usingthe laser beam may be collected using the suction holes of the worktable for laser processing S500. The work table for laser processing mayinclude the groove region. The groove region may include the pluralityof suction holes. The suction holes may be coupled to the suction pathformed in the lower plate of the work table for laser processing usinggun drill processing. The suction path may be coupled to an externalexhaust device through the second channel. The suction force may betransferred to the suction holes according to an operation of theexhaust device. For example, the exhaust device may include aninhalation motor and a dust collector. The suction force may betransferred to the groove region of the upper plate through the suctionhole, and then the particles and fumes generated in the cutting processof the substrate may be removed. Here, a low-contamination surfacetreatment may be performed on the groove region, suction hole, andsuction path. In some exemplary embodiments of the present invention,the groove region, suction hole, and suction path may be coated withTeflon or Polyether ether ketone (Peek). When the groove region, suctionhole, and suction path are coated with Teflon or Polyether ether ketone(Peek), residues of the particles or residues of the fumes might notremain on the groove region, the suction hole, and the suction path. Insome exemplary embodiments of the present invention, a plurality ofbumps may be formed on the surface of the groove region, the surface ofthe suction hole, and the surface of the suction path. When the bumpsare formed on the surface of the groove region, the surface of thesuction hole, and the surface of the suction path, the particles andfumes inhaled through the suction holes and the suction path may becollected on the bumps.

FIG. 7 is a flow chart illustrating a method of cleaning the work tablefor laser processing of FIG. 6 in accordance with exemplary embodimentsof the present invention.

The substrate may be divided into a plurality of cells by the cuttingprocess. The divided substrate (for example, the cells) may be removedfrom the work table for laser processing after the cutting process S600.Here, the absorption device coupled to the absorption holes and theexhaust device coupled to the suction holes might not be operated.

The work table for laser processing may perform the cleaning process bycoupling the blower to the suction path coupled to the suction holesS700. The suction path may be coupled to the blower in the cleaningprocess. The blower may provide air or a material having pressure to thesuction holes in an opposite direction to the air provided from theexhaust device coupled to the suction holes during the cutting process.Thus, the particles and fumes accumulated in the suction holes may beremoved. Here, the external blower may ionize the particles and thefumes in the suction path. For example, the external blower may ionizethe particles and the fumes on the surface of the suction path byspraying nitrogen (N) to the suction path. The particles and the fumes,having been ionized, may be more easily detached from the surface of thesuction path because adhesion of the particles and the fumes may beweakened.

As described above, the operation method of the work table for laserprocessing may reduce contamination of the substrate and the work tablefor laser processing by including the absorption holes and the suctionholes on the work table for laser processing and removing the particlesand fumes generated in the cutting process using the laser beam throughthe suction hole. Further, the cleaning process may be augmented usingthe suction holes.

The present inventive concept may be applied to a manufacturing deviceincluding a work table for laser processing. For example, the presentinventive concept may be applied to a laser processing apparatus thatcuts a substrate, a film, a glass, etc.

The foregoing is illustrative of exemplary embodiments of the presentinvention. Although a few exemplary embodiments of the present inventionhave been described, those skilled in the art will readily appreciatethat many modifications are possible in the example embodiments withoutmaterially departing from the novel teachings and aspects of the presentinventive concept.

What is claimed is:
 1. A method of operating a work table for laserprocessing, comprising: disposing the work table for laser processing ona base; fixing a substrate to the work table by covering one or moreabsorption holes of the work table with the substrate, the one or moreabsorption holes supplying a first vacuum pressure; cutting the fixedsubstrate along cutting hues using a laser beam; and collecting particlegenerated during the cutting of the substrate using one or more suctionholes of the work table that are disposed along the cutting lines of thesubstrate, under the substrate, the one or more suction holes supplyinga second vacuum pressure, wherein the first vacuum pressure is greaterthan the second vacuum pressure, and wherein the absorption holes andthe suction holes have distinct suction paths that do not connect toeach other.
 2. The method of claim 1, further comprising: removing thesubstrate from the work table; coupling a suction path coupled to thesuction holes to a blower; and cleaning the work table by using theblower to provide a positive pressure to the suction holes that is anopposite pressure to suction that is provided to the suction holesduring the cutting.
 3. The method of claim 1, wherein a surfacetreatment is performed on the suction holes and the suction path coupledto the suction holes.
 4. The method of claim 3, wherein a plurality ofbumps are formed on a surface of the suction holes and a surface of thesuction path.
 5. The operation method of claim 3, wherein the surfacetreatment includes coating a surface of a groove region, a surface ofthe suction holes, and a surface of the suction path withPolytetrafluoroethylene (PTFE) or Polyether ether ketone (Peek).
 6. Theoperation method of claim 1, wherein each of the more absorption holesis larger than each of the one or more suction holes.
 7. A method ofoperating a work table for laser processing, comprising: disposing thework table for laser processing on a base; fixing a substrate to thework table by covering one or more absorption holes of the work tablewith the substrate, the one or more absorption holes supplying a firstvacuum pressure; cutting the fixed substrate along cutting lines using alaser beam; and collecting particles generated during the cutting of thesubstrate using one or more suction holes of the work table that aredisposed along the cutting lines of the substrate, under the substrate,the one or more suction holes supplying a second vacuum pressure,wherein the first vacuum pressure is greater than the second vacuumpressure, wherein a surface treatment is performed on the suction holesand the suction path coupled to the suction holes, and wherein aplurality of bumps are formed on a surface of the suction holes and asurface of the suction path.
 8. The method of claim 7, furthercomprising: removing the substrate from the work table; coupling asuction path coupled to the suction holes to a blower; and cleaning thework table by using the blower to provide a positive pressure to thesuction holes that is an opposite pressure to suction that is providedto the suction holes during the cutting.
 9. The method of claim 7,wherein the surface treatment includes coating a surface of a grooveregion, a surface of the suction holes, and a surface of the suctionpath with Polytetrafluoroethylene (PTFE) or Polyether ether ketone(Peek).
 10. The method of claim 7, wherein each of the one or moreabsorption holes is larger than each of the one or more suction holes.